Residual stress evolution regularity in thermal barrier ceramic coatings （TBCs） under different cycles of thermal shock loading of 1 100℃ was investi- gated by the microscopic digital image correlation （DIC） and micro-Raman spec- troscopy, respectively. The obtained results showed that, as the cycle number of the thermal shock loading increases, the evolution of the residual stress under- goes three distinct stages： a sharp increase, a gradual change, and a reduction. The extension stress near the TBC surface is fast transformed to compressive one through just one thermal cycle. After different thermal shock cycles with peak temperature of 1 100℃, phase transformation in TBC does not happen, whereas the generation, development, evolution of the thermally grown oxide （TGO） layer and micro-cracks are the main reasons causing the evolution regularity of the residual stress.
Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review o[ several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.
